Laser processing machine
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United States of America Patent
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Jun 25, 2024
Grant Date -
Mar 18, 2021
app pub date -
Nov 24, 2020
filing date -
Jun 1, 2015
priority date (Note) -
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Abstract
A laser processing machine for killing specific cells from a group of cells on a surface of a layer containing an ingredient capable of absorbing laser light, the laser processing machine being configured to: control a laser light source to output laser light at 5W or less and at a wavelength of 380 nm or greater such that the laser light source is applied to a second area on a second surface of the layer opposed to the first surface; and control an actuator to provide a relative movement between the second area where the laser light is applied and the layer at a rate of 2000 mm/sec or less such that the irradiated second area absorbs energy to generate heat that kills unwanted cells on a first area of the first surface and the laser light does not instantly kill the specific cells on the first area upon irradiation.
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