Polymer material, composition, and method of manufacturing semiconductor device

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United States of America

PATENT NO 12018107
SERIAL NO

17515253

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Abstract

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According to one embodiment, a polymer material is disclosed. The polymer material contains a polymer. The polymer contains a first monomer unit having a lone pair and an aromatic ring at a side chain, and a second monomer unit including a crosslinking group at a terminal of the side chain, with its molar ratio of 0.5 mol % to 10 mol % to all monomer units in the polymer. The polymer material can be used for manufacturing a composite film as a mask pattern for processing a target film on a substrate. The composite film can be formed by a process including, forming an organic film on the target film with the polymer material, patterning the organic film, and forming the composite film by impregnating a metal compound into the patterned organic film.

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Patent Owner(s)

Patent OwnerAddress
KIOXIA CORPORATION1-21 SHIBAURA 3-CHOME MINATO-KU TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Asakawa, Koji Kawasaki Kanagawa, JP 222 4558
Sasao, Norikatsu Kawasaki Kanagawa, JP 47 84
Sugimura, Shinobu Yokohama Kanagawa, JP 63 247

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