Molding device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 12017401
APP PUB NO 20230264411A1
SERIAL NO

18164268

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A molding device may comprise a mold, a plate, and a ring. The mold may comprise: a lower surface; an upper surface parallel to the lower surface; a hole defined in a part of the upper surface; and a through hole extending from a bottom surface of the hole to the lower surface of the mold. The plate may comprise a surface with a gas outlet defined therein. The ring may be arranged between the lower surface of the mold and the surface of the plate and connecting the mold and the plate. The ring may surround the through hole exposed on the lower surface of the mold and the gas outlet exposed on the surface of the plate. In a region where the ring is not arranged, a space may be defined between the lower surface of the mold and the surface of the plate.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
KABUSHIKI KAISHA TOYOTA CHUO KENKYUSHO41-1 YOKOMICHI NAGAKUTE-SHI AICHI-KEN 480-1192

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Akashi, Teruhisa Nagakute, JP 40 260
Fujitsuka, Norio Nagakute, JP 11 244
Goto, Katsuaki Nisshin, JP 11 18
Harada, Shota Nisshin, JP 17 22
Inagaki, Yuuki Nisshin, JP 12 13
Ito, Keitaro Nisshin, JP 13 12
Shimaoka, Keiichi Nagakute, JP 20 442
Yoshida, Takahiko Nisshin, JP 107 1228

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