Integration and bonding of micro-devices into system substrate
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United States of America Patent
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Jun 18, 2024
Grant Date -
Jan 21, 2021
app pub date -
Sep 24, 2020
filing date -
Nov 14, 2017
priority date (Note) -
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Abstract
This disclosure is related to integrating optoelectronics microdevices into a system substrate for efficient and durable electrical bonding between two substrates at low temperature. 2D nanostructures and 3D scaffolds may create interlocking structures for improved bonding properties. Addition of nanoparticles into the structure creates high surface area for better conduction. Application of curing agents before or after alignment of micro devices and receiving substrates further assists with formation of strong bonds.
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