Reduction or elimination of pattern placement error in metrology measurements

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United States of America Patent

PATENT NO 12013634
APP PUB NO 20230099105A1
SERIAL NO

18076375

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Metrology methods and targets are provided for reducing or eliminating a difference between a device pattern position and a target pattern position while maintaining target printability, process compatibility and optical contrast—in both imaging and scatterometry metrology. Pattern placement discrepancies may be reduced by using sub-resolved assist features in the mask design which have a same periodicity (fine pitch) as the periodic structure and/or by calibrating the measurement results using PPE (pattern placement error) correction factors derived by applying learning procedures to specific calibration terms, in measurements and/or simulations. Metrology targets are disclosed with multiple periodic structures at the same layer (in addition to regular target structures), e.g., in one or two layers, which are used to calibrate and remove PPE, especially when related to asymmetric effects such as scanner aberrations, off-axis illumination and other error sources.

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Patent Owner(s)

Patent OwnerAddress
KLA-TENCOR CORPORATIONONE TECHNOLOGY DRIVE MILPITAS CA 95035

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Aharon, Sharon Hanaton, IL 6 17
Feler, Yoel Haifa, IL 43 460
Ghinovker, Mark Yoqneam llit, IL 86 1926
Golotsvan, Anna Qiryat Tivon, IL 14 24
Gronheid, Roel Leuven, BE 29 817
Gurevich, Evgeni Yokneam Illit, IL 11 81
Levinski, Vladimir Migdal HaEmek, IL 106 1375

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