Device and method for providing a thermally conductive coupling
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 18, 2024
Grant Date -
Jun 8, 2023
app pub date -
May 11, 2021
filing date -
May 13, 2020
priority date (Note) -
In Force
status (Latency Note)
Importance
Loading Importance Indicators... 
Abstract
A device intended for cooling an object being moved within a cryostat comprises a heat transfer section forming a contact surface for said object and means for fastening the heat transfer section to a cooling structure in such a way that said contact surface remains free. The device comprises a spring section which is separate from said heat transfer section and which is arranged to exert on the heat transfer section a spring force pushing said contact surface in a direction in which it is intended to contact said object.
First Claim
Other Claims data not available
Family
Loading Family data...
International Classification(s)
- 2021 Application Filing Year
- F17C Class
- 442 Applications Filed
- 190 Patents Issued To-Date
- 42.99 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- F17C Class
- 0 % this patent is cited more than
- 1 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 3.5 Year Payment | $1600.00 | $800.00 | $400.00 | Dec 18, 2027 |
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Dec 18, 2031 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Dec 18, 2035 |
