Flux, solder paste, and electronic circuit board

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12011787
SERIAL NO

17601722

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Importance

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Abstract

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A flux used for soldering with a tin-silver-copper alloy comprises an imidazole compound and/or an imidazoline compound; a dicarboxylic acid having 3 or more and 36 or less carbons; and a quaternary ammonium iodine salt. Relative to the total amount of the flux, the dicarboxylic acid content is 6 mass % or more and 25 mass % or less, and the iodine content is 200 ppm or more and 3600 ppm or less.

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Patent Owner(s)

  • HARIMA CHEMICALS, INCORPORATED

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ikeda, Kazuki Kakogawa, JP 43 271
Tanaka, Syota Kakogawa, JP 1 0

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