Welding method of demetallized ceramic substrate having surface capillary microgroove structure

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United States of America Patent

PATENT NO 12009270
APP PUB NO 20220293480A1
SERIAL NO

17607901

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Abstract

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The present invention discloses a welding method of a demetallized ceramic substrate having a surface capillary microgroove structure. The demetallized ceramic substrate includes a ceramic substrate main body and surface capillary microstructures. The surface capillary microstructures are arranged on two lateral sides of the ceramic substrate main body and the surface capillary microstructures specifically are capillary microgrooves. The welding method includes the following steps: fixing a chip to an upper surface of the demetallized ceramic substrate having the surface capillary microgroove structure, fixing the ceramic substrate with the chip to a printed circuit board having a bonding pad, and placing melted solder on the bonding pad, and driving the solder to ascend to an electrode of the chip from the bonding pad in a lower layer by means of a capillary force, thereby realizing an electrical connection between the chip and the printed circuit board.

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Patent Owner(s)

Patent OwnerAddress
SOUTH CHINA UNIVERSITY OF TECHNOLOGY510640 NO FIVE 381 MOUNTAIN ROAD GUANGZHOU GUANGDONG TIANHE DISTRICT GUANGZHOU CITY GUANGDONG PROVINCE 510640
GUANGDONG LUCKYSTAR ELECTRONIC TECHNOLOGY CO LTDNO 10 FUSHENG ROAD HECHENG STREET GAOMING DISTRICT FOSHAN GUANGDONG 528531
SHENZHEN GOOD-MACHINE AUTOMATIC EQUIPMENT CO LTDZONE A OF 10TH FLOOR BUILDING 2 10TH INDUSTRIAL ZONE TIANLIAO COMMUNITY GUANGDONG 518132

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ding, Xinrui Guangzhou, CN 3 0
Li, Zongtao Guangzhou, CN 10 9
Liang, Guanwei Guangzhou, CN 2 0
Tang, Yong Guangzhou, CN 87 515
Wang, Hong Guangzhou, CN 1168 13527
Wu, Kejian Guangzhou, CN 2 55
Yu, Shudong Guangzhou, CN 2 0

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