Heater lift assembly spring damper

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 12009232
APP PUB NO 20220319880A1
SERIAL NO

17843602

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Abstract

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In an embodiment, an apparatus comprising: a heater configured to heat a wafer located on a wafer staging area of the heater, the heater comprising a heater shaft extending below the wafer staging area; and a heater lift assembly comprising: a lift shaft configured to move the heater shaft in a vertical direction; a clamp that connects the heater shaft to the lift shaft; and a damper disposed on top of the clamp.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Chun-Ta Hsinchu, TW 71 627
Hsieh, Chin-Shen Hsinchu, TW 10 1
Huang, Cheng-Yi Hsinchu, TW 82 288
Wu, Kai-Wen Hsinchu, TW 70 89

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