Low temperature chuck for plasma processing systems

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 12009228
APP PUB NO 20230223281A1
SERIAL NO

18175104

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A wafer chuck assembly includes a puck, a shaft and a base. The puck includes an electrically insulating material that defines a top surface of the puck; a plurality of electrodes are embedded within the electrically insulating material. The puck also includes an inner puck element that forms one or more channels for a heat exchange fluid, the inner puck element being in thermal communication with the electrically insulating material, and an electrically conductive plate disposed proximate to the inner puck element. The shaft includes an electrically conductive shaft housing that is electrically coupled with the plate, and a plurality of connectors, including electrical connectors for the electrodes. The base includes an electrically conductive base housing that is electrically coupled with the shaft housing, and an electrically insulating terminal block disposed within the base housing, the plurality of connectors passing through the terminal block.

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Patent Owner(s)

Patent OwnerAddress
APPLIED MATERIALS INC3050 BOWERS AVENUE SANTA CLARA CA 95054

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cho, Tae Seung San Jose, US 21 1170
Kobayashi, Satoru Sunnyvale, US 226 3972
Lubomirsky, Dmitry Cupertino, US 306 29707
Park, Soonam Sunnyvale, US 102 11141
Phi, Son M Milpitas, US 4 273
Tran, Toan Q San Jose, US 31 2896
Venkataraman, Shankar San Jose, US 138 17666
Weng, Zilu San Diego, US 5 377

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