Packaging structure of flexible sensing strip for monitoring large deformation at deep position of sliding mass and monitoring method

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United States of America Patent

PATENT NO 12007230
APP PUB NO 20220412718A1
SERIAL NO

17401332

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Abstract

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A measurement unit module includes a printed circuit board (PCB) and electronic components being mounted on a front face of the PCB, a plurality of measurement unit modules are arranged at intervals in an extending direction of a stripped flat cable, the stripped flat cable is electrically connected to back faces of the plurality of PCBs in sequence to form a measurement unit cluster, the measurement unit cluster is packaged and molded by an extrusion technology of silica gel to form the flexible sensing strip, and the flexible sensing strip can be wound into a sensing strip reel. The packaging structure has the beneficial effects that connection integrity between the measurement unit modules is enhanced, connection strength is improved, and reliability of a flexible clinometer is improved. The flexible sensing strip can be wound into the sensing strip reel so as to be convenient to carry and convey.

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Patent Owner(s)

Patent OwnerAddress
CHINA UNIVERSITY OF GEOSCIENCES (WUHAN)NO 388 LUMO ROAD HONGSHAN DISTRICT WUHAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Li, Changdong Wuhan, CN 173 10
Lin, Chengyuan Wuhan, CN 33 16
Lu, Guiying Wuhan, CN 2 0
Tang, Huiming Wuhan, CN 17 21
Wang, Yuansheng Wuhan, CN 1 0
Xia, Ding Wuhan, CN 10 23
Zhang, Junrong Wuhan, CN 13 6
Zhang, Yongquan Wuhan, CN 13 6

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