Self-assembly of shell-based architected materials
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United States of America Patent
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Jun 11, 2024
Grant Date -
Nov 4, 2021
app pub date -
Sep 25, 2020
filing date -
Sep 27, 2019
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Abstract
In an aspect, provided herein are low density materials, including shell-based materials, with three-dimensional architectures formed, in part, via self-assembly processes. Shell-based materials of some embodiments exhibit a combination of ultralow density (e.g., ≤100 mg cm−3 and optionally ≤10 100 mg cm−3) and non-periodic architectures characterized by low defect densities and geometries avoiding stress concentrations. Low density shell based materials of some embodiments have architectures characterized by small curvatures and lack of straight edges providing enhance mechanical response. In some embodiments, for example, the present low density materials, including shell-based materials, providing a combination target mechanical properties including high stiffness-to-density ratios, mechanical resilience and tolerance for deformation.
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