Barrier structures for underfill containment

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 12002727
APP PUB NO 20210249322A1
SERIAL NO

16788186

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Abstract

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An integrated circuit assembly may be formed comprising an electronic substrate, a first and second integrated circuit device each having a first surface, a second surface, at least one side extending between the first and second surface, and an edge defined at an intersection of the second surface and the at least one side of each respective integrated circuit device, wherein the first surface of each integrated circuit device is electrically attached to the electronic substrate, an underfill material between the first surface of each integrated circuit device and the electronic substrate, and between the sides of the first and second integrated circuit devices, and at least one barrier structure adjacent at least one of the edge of first integrated circuit device and the edge of the second integrated circuit device, wherein the underfill material abuts the at least one barrier structure.

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Patent Owner(s)

Patent OwnerAddress
INTEL CORPORATION2200 MISSION COLLEGE BLVD SANTA CLARA CA 95052

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Brun, Xavier Hillsboro, US 28 24
Cetegen, Edvin Chandler, US 50 171
Choudhury, Soud Chandler, US 1 3
Guo, Yang Chandler, US 122 1205
Li, Wei Chandler, US 2284 14552
Lin, Ziyin Chandler, US 56 18
Liu, Nai-Yuan Chandler, US 2 3
Mehta, Vipul Chandler, US 13 15
Okafor, Ifeanyi Chandler, US 2 3
Rumer, Christopher Chander, US 1 3
Wang, Hsin-Wei Chandler, US 15 28
Zhong, Shan Chandler, US 52 606

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