Apparatus for generating etchants for remote plasma processes

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United States of America Patent

PATENT NO 12002659
APP PUB NO 20230402262A1
SERIAL NO

17869987

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A remote plasma source (RPS) for generating etchants leverages symmetrical hallow cathode cavities to increase etchant rates. The RPS includes an upper electrode with a first hollow cavity configured to induce a hollow cathode effect within the first hollow cavity, a lower electrode with a second hollow cavity configured to induce a hollow cathode effect within the second hollow cavity, wherein the first hollow cavity and the second hollow cavity are symmetrical, a first gap positioned between and electrically separating the upper electrode and the lower electrode, and an annular dielectric cover in direct contact with the lower electrode in the first gap and forms a second gap between an uppermost surface of the annular dielectric cover and a lowermost surface of the upper electrode. The annular dielectric cover fills approximately 50% to approximately 95% of a height of the first gap.

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Patent Owner(s)

  • APPLIED MATERIALS, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Benjaminson, David Michael Campbell, US 1 0
Cho, Tae Seung San Jose, US 21 1170
Choy, Martin Yue San Ramon, US 8 1037
Gunaseelan, Pratheep Fremont, US 1 0
Huang, Chih-Yung San Jose, US 73 507
Pakulski, Ryan Michael Brentwood, US 2 14
Schatz, Kenneth Los Altos, US 1 0

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