Manufacturing method of package on package structure

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11996400
APP PUB NO 20220254767A1
SERIAL NO

17731240

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Abstract

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A manufacturing method of a package-on-package structure includes at least the following steps. Top packages are mounted on a top side of a reconstructed wafer over a flexible tape, where conductive bumps at a bottom side of the reconstructed wafer is attached to the flexible tape, and during the mounting, a shape geometry of the respective conductive bump changes and at least a lower portion of the respective conductive bump is embraced by the flexible tape. The flexible tape is released from the conductive bumps after the mounting.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTDHSIN-CHU 300-77

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Chia-Lun Tainan, TW 39 160
Chen, Cheng-Ting Taichung, TW 51 444
Chung, Philip Yu-Shuan Taipei, TW 17 28
Hsieh, Ching-Hua Hsinchu, TW 265 2259
Kuo, Hsuan-Ting Taichung, TW 49 295
Lin, Hsiu-Jen Hsinchu County, TW 172 1408
Pei, Hao-Jan Hsinchu, TW 46 104
Tsai, Yu-Peng Taipei, TW 43 1203
Tsao, Chih-Chiang Taoyuan, TW 48 96

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