Method and apparatus for debonding temporarily bonded wafers in wafer-level packaging applications
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
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May 28, 2024
Grant Date -
N/A
app pub date -
Dec 15, 2020
filing date -
Dec 15, 2020
priority date (Note) -
In Force
status (Latency Note)
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Abstract
An apparatus for debonding a wafer from a bonded wafer stack is disclosed. The apparatus includes a flashlamp, a flashlamp control unit, and a wafer debonding unit. A processed wafer can be debonded from a bonded wafer stack by applying light pulses from the flashlamp. The flashlamp is controlled by the flashlamp control unit that includes a capacitor bank, a power supply for charging the capacitor bank, an IGBT-based switching device, and a frequency controller. The wafer debonding unit includes a debonding vacuum table, a wafer feeding robot for conveying the bonded wafer stack to the debonding vacuum table, a set of suction cups for applying vacuum to the bonded wafer stack when light pulses are being emitted by the flashlamp to debond the processed wafer from the bonded wafer stack.
First Claim
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International Classification(s)
- 2020 Application Filing Year
- H01L Class
- 29783 Applications Filed
- 21134 Patents Issued To-Date
- 70.96 % Issued To-Date
Cited Art Landscape
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- 0 Citation Count
- H01L Class
- 0 % this patent is cited more than
- 1 Age
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