Insulating medium rubber film and production method thereof and multi-layer printed-circuit board

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United States of America

PATENT NO 11993704
SERIAL NO

17279845

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Abstract

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An insulating medium rubber film and a production method thereof, and a multi-layer printed-circuit board. The insulating medium rubber film includes a release film and an insulating medium layer arranged on the surface of the release film, where materials of the insulating medium layer include saturated polyester resin, amino resin or blocked isocyanate, epoxy resin, a curing agent, inorganic filler and a curing accelerator. According to the insulating medium rubber film and the production method thereof and the multi-layer printed-circuit board, by introducing the saturated polyester resin component into an epoxy resin composition, the produced insulating medium rubber film has the advantages that a dielectric constant is low, a dielectric dissipation factor is low, thermal expansion is not liable to happen, and adhesion is good.

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Patent Owner(s)

Patent OwnerAddress
SHENZHEN NEWFILMS NEW MATERIAL TECHNOLOGY CO LTD301 NO 8 HOU-DI-KENG-SHUI-KU INDUSTRIAL PARK SHI-JIA VILLAGE MATIAN STREET GUANGMING DISTRICT SHENZHEN GUANGDONG 518105 518105

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
He, Qiong Shenzhen, CN 19 9
He, Yueshan Shenzhen, CN 15 36
Liu, Fei Shenzhen, CN 433 2676

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