Structures and sensor assemblies having engagement structures for securing a compliant substrate assembly
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United States of America Patent
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May 28, 2024
Grant Date -
May 4, 2023
app pub date -
May 31, 2022
filing date -
Oct 28, 2021
priority date (Note) -
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Abstract
Structures and sensor assemblies having engagement structures for securing a compliant substrate assembly are disclosed. In one embodiment, a sensor assembly includes a compliant substrate assembly having a base layer, and a deformable layer heat-sealed to the base layer such that the base layer and the deformable layer define at least one inflatable chamber. The sensor assembly further includes a first member proximate to a first edge of the compliant substrate assembly, a second member proximate to a second edge of the compliant substrate assembly, wherein the second edge is opposite the first edge, and at least one pressure sensor fluidly coupled to the at least one inflatable chamber and operable to produce a signal indicative of a pressure within the at least one inflatable chamber.
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