Method of preparing gypsum wallboard from high salt gypsum, and related product
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 28, 2024
Grant Date -
May 6, 2021
app pub date -
Jun 18, 2020
filing date -
Nov 5, 2019
priority date (Note) -
In Force
status (Latency Note)
![]() |
A preliminary load of PAIR data current through [] has been loaded. Any more recent PAIR data will be loaded within twenty-four hours. |
PAIR data current through []
A preliminary load of cached data will be loaded soon.
Any more recent PAIR data will be loaded within twenty-four hours.
![]() |
Next PAIR Update Scheduled on [ ] |

Importance

US Family Size
|
Non-US Coverage
|
Abstract
Disclosed are a composite gypsum board and a method of preparing composite gypsum board. The board contains set gypsum layers sandwiched between two cover sheets. The set gypsum layers are formed from at least stucco and water. The set gypsum layers include a board core and one or more skim coat layers. The set gypsum core makes up a substantial thickness (e.g., at least about 90%, at least about 92%, at least about 95%, or at least about 97%) of the total thickness of all the gypsum layers. A first skim coat layer is included on one side of the core, facing a first (face) cover sheet. A second skim coat layer is included on the other side of the core, facing a second (back) cover sheet. At least the second skim layer is formed from a slurry that contains starch. The stucco material generally includes a high salt impurity content, for example, when the stucco is calcined from certain sources of low-quality synthetic gypsum. For example, in some embodiments, the salts are chloride salts, e.g., sodium chloride (NaCl), potassium chloride (KCl), magnesium chloride (MgCl2), and/or calcium chloride (CaCl2).

First Claim
Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
UNITED STATES GYPSUM COMPANY | 550 WEST ADAMS STREET CHICAGO IL 60661 |
International Classification(s)

- [Classification Symbol]
- [Patents Count]
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Hemphill, Mark K | Hawthorn Woods, US | 14 | 200 |
Li, Qinghua | Rolling Meadows, US | 749 | 11147 |
Cited Art Landscape
- No Cited Art to Display

Patent Citation Ranking
Forward Cite Landscape
- No Forward Cites to Display

Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
3.5 Year Payment | $1600.00 | $800.00 | $400.00 | Nov 28, 2027 |
7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Nov 28, 2031 |
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Nov 28, 2035 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 3.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 7.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text

Legal Events

Matter Detail

Renewals Detail

Note
The template below is formatted to ensure compatibility with our system.
Provide tags with | separated like (tags1|tags2).
Maximum length is 128 characters for Customer Application No
Mandatory Fields * - 'MatterType','AppType','Country','Title','SerialNo'.
Acceptable Date Format - 'MM/DD/YYYY'.
Acceptable Filing/App Types -
- Continuation/Divisional
- Original
- Paris Convention
- PCT National
- With Priority
- EP Validation
- Provisional Conversion
- Reissue
- Provisional
- Foreign Extension
Acceptable Status -
- Pending
- Abandoned
- Unfiled
- Expired
- Granted
Acceptable Matter Types -
- Patent
- Utility Model
- Supplemental Protection Certificate
- Design
- Inventor Certificate
- Plant
- Statutory Invention Reg
Advertisement
Advertisement
Advertisement

Recipient Email Address

Recipient Email Address

Comment
Recipient Email Address

Success
E-mail has been sent successfully.
Failure
Some error occured while sending email. Please check e-mail and try again!
PAIR load has been initiated
A preliminary load of cached data will be loaded soon. Current PAIR data will be loaded within twenty four hours.
File History PDF
Thank you for your purchase! The File Wrapper for Patent Number 11993054 will be available within the next 24 hours.
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:

Last Refreshed On:
Changes done successfully
Important Notes on Latency of Status data
Please note there is up to 60 days of latency in this Status indicator for certain status conditions. You can obtain up-to-date Status indicator readings by ordering PAIR for the file.
An application with the status "Published" (which means it is pending) may be recently abandoned, but not yet updated to reflect its abandoned status. However, an application filed less than one year ago is unlikely to be abandoned.
A patent with the status "Granted" may be recently expired, but not yet updated to reflect its expired status. However, it is highly unlikely a patent less than 3.5 years old would be expired.
An application with the status "Abandoned" is almost always current, but there is a small chance it was recently revived and the status not yet updated.
Important Note on Priority Date data
This priority date is an estimated earliest priority date and is purely an estimation. This date should not be taken as legal conclusion. No representations are made as to the accuracy of the date listed. Please consult a legal professional before relying on this date.
We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level. Upgrade to our Level for up to -1 portfolios!.