Method for manufacturing resin molded product
Number of patents in Portfolio can not be more than 2000
United States of America
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May 28, 2024
Grant Date -
N/A
app pub date -
Feb 27, 2020
filing date -
Feb 27, 2020
priority date (Note) -
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Abstract
Provided is a resin molding apparatus that can suppress a molding problem caused by a variation in a thickness of an object to be molded or suppress a variation in a thickness of a resin molded part, and can perform a mold releasing operation. A resin molding apparatus includes: a molding mold having one mold and the other mold; one mold wedge mechanism; and one mold cavity block driving mechanism. In a state that a height position of one mold cavity block is set using the one mold cavity block driving mechanism and a position in a direction away from the other mold in the one mold cavity block having been moved to the height position is fixed to be limited using the one mold wedge mechanism, a mold releasing operation can be performed using the one mold wedge mechanism and the one mold cavity block driving mechanism.
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