Hermetic electrical feedthrough comprising a Pt—Ni-based pin alloy
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United States of America Patent
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May 21, 2024
Grant Date -
Oct 21, 2021
app pub date -
Apr 12, 2021
filing date -
Apr 17, 2020
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Abstract
A combination of materials and processing parameters have been developed for hermetic seals for electrical feedthroughs in high performance applications. A glass-ceramic forms a hermetic seal between a stainless steel shell and a platinum-nickel-based (Pt—Ni) pin alloy for electrical feedthroughs. The glass-ceramic is processed to develop a coefficient of thermal expansion (CTE) slightly higher than the pin alloy but lower than the stainless steel. The seal system employing the new processing conditions and Pt—Ni-based pin alloy alleviates several problems encountered in previous seal systems and improves the hermetic connector performance.
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