Semiconductor devices and methods for forming the same
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United States of America
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May 21, 2024
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N/A
app pub date -
Oct 8, 2021
filing date -
Oct 8, 2021
priority date (Note) -
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Abstract
A method for forming semiconductor devices includes providing a substrate with a conductive pad formed thereon; forming a transparent structure over the substrate, wherein the transparent structure includes a plurality of collimating pillars adjacent to the conductive pad; forming a light-shielding structure over the plurality of collimating pillars and the conductive pad; performing a cutting process to remove one or more materials directly above the conductive pad, while leaving remaining material to cover the conductive pad, wherein the material includes a portion of the light-shielding structure; and performing an etching process to remove the remaining material to expose the conductive pad.
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