Soldering apparatus
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 21, 2024
Grant Date -
May 11, 2023
app pub date -
Nov 9, 2022
filing date -
Nov 9, 2021
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A soldering apparatus, in particular a reflow soldering apparatus, for continuous soldering of printed circuit boards along a transport direction, having a process channel that includes a preheating zone, a soldering zone and a cooling zone, having a base body and a cover hood movable between a closed position and an open position, wherein nozzle plates, fan units with fan motors, air channels carrying the process gas, filter elements and/or cooling elements are provided in the base body. At least one fan unit is arranged in or on the base body laterally next to the process channel in the transport direction, and air channels are arranged and provided in such a manner that process gas is blown into the process channel during operation of the at least one fan unit, with the process gas directed through a filter element provided in a filter region after passing through the process channel, and the filtered process gas drawn in by the at least one fan unit.
First Claim
Other Claims data not available
Family
International Classification(s)
- 2022 Application Filing Year
- B23K Class
- 1814 Applications Filed
- 440 Patents Issued To-Date
- 24.26 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- B23K Class
- 0 % this patent is cited more than
- 1 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 3.5 Year Payment | $1600.00 | $800.00 | $400.00 | Nov 21, 2027 |
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Nov 21, 2031 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Nov 21, 2035 |
