Flexible laminated board and multilayer circuit board

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11985762
APP PUB NO 20210153348A1
SERIAL NO

17157695

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Abstract

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A flexible laminated sheet manufacturing method includes thermocompression-bonding an insulation film formed of a liquid crystal polymer onto a metal foil between endless belts to form a flexible laminated sheet. The thermocompression bonding includes heating the flexible laminated sheet so that the maximum temperature of the sheet is in the range from a temperature that is 45° C. lower than the melting point of the liquid crystal polymer to a temperature that is 5° C. lower than the melting point. The thermocompression bonding also includes slowly cooling the flexible laminated sheet so that an exit temperature, which is a temperature of the sheet when transferred out of the endless belts, is in the range from a temperature that is 235° C. lower than the melting point of the liquid crystal polymer to a temperature that is 100° C. lower than the melting point.

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Patent Owner(s)

Patent OwnerAddress
UBE EXSYMO CO LTDTOKYO

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Arima, Takao Tokyo, JP 3 29
Kasahara, Junya Tokyo, JP 4 13
Kondoh, Kouji Kariya, JP 16 134
Miyagawa, Eijirou Kariya, JP 10 50
Suzuki, Taro Tokyo, JP 54 302
Tachibana, Eisuke Tokyo, JP 3 39
Totani, Makoto Kariya, JP 17 267

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