Bonded body and acoustic wave element

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United States of America Patent

PATENT NO 11984870
APP PUB NO 20210234529A1
SERIAL NO

17231162

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Abstract

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A bonded body includes a supporting substrate composed of a metal oxide, a piezoelectric material substrate, a bonding layer provided between the supporting substrate and piezoelectric material substrate and having a composition of Si(1-x)Ox (0.008≤x≤0.408), and an amorphous layer provided between the bonding layer and supporting substrate. The oxygen ratio of the amorphous layer is higher than the oxygen ratio of the supporting substrate.

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Patent Owner(s)

  • NGK INSULATORS LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Goto, Masashi Nagoya, JP 92 1116
Tai, Tomoyoshi Inazawa, JP 57 806
Uno, Yudai Nagoya, JP 19 111

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