Local metallization for semiconductor substrates using a laser beam
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United States of America Patent
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May 14, 2024
Grant Date -
Aug 25, 2022
app pub date -
May 9, 2022
filing date -
Apr 6, 2018
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Abstract
Local metallization of semiconductor substrates using a laser beam, and the resulting structures, e.g., micro-electronic devices, semiconductor substrates and/or solar cells, are described. For example, a solar cell includes a substrate and a plurality of semiconductor regions disposed in or above the substrate. A plurality of conductive contact structures is electrically connected to the plurality of semiconductor regions. Each conductive contact structure includes a locally deposited metal portion disposed in contact with a corresponding a semiconductor region.
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