Leadless power amplifier packages including topside termination interposer arrangements and methods for the fabrication thereof
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United States of America Patent
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May 14, 2024
Grant Date -
Apr 13, 2023
app pub date -
Sep 30, 2021
filing date -
Sep 30, 2021
priority date (Note) -
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Abstract
Leadless power amplifier (PA) packages having topside termination interposer (TTI) arrangements, and associated fabrication methods, are disclosed. Embodiments of the leadless PA package include a base flange, a first set of interposer mount pads, a first RF power die, a package body. The first RF power die is attached to a die mount surface of the base flange and electrically interconnected with the first set of interposer mount pads. The TTI arrangement is electrically coupled to the first set of interposer mount pads and projects therefrom in the package height direction. The package body encloses the first RF power die and having a package topside surface opposite the lower flange surface. Topside input/output terminals of the PA package are accessible from the package topside surface and are electrically interconnected with the first RF power die through the TTI arrangement and the first set of interposer mount pads.
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