Manufacturing monitoring assistance device, manufacturing monitoring assistance method, and manufacturing monitoring assistance program

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United States of America

PATENT NO 11982998
SERIAL NO

17413417

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Abstract

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A manufacturing monitoring assistance device includes: a model creation unit creating a computation model when a product as a sample is normal, based on a three-dimensional form acquired from the product; a simulation unit creating a corrective computation model when the product is abnormal, by adding a sample of an abnormal portion in the product to the created computation model, and performing a simulation on each of the computation model and the corrective computation model; and a monitoring method determination unit determining a method for monitoring a manufacturing process for the product, based on an abnormality index being a difference between an output from a sensor as a result of the simulation performed on the computation model and an output from a sensor as a result of the simulation performed on the corrective computation model, and causing an output device to display the determined method and the abnormality index.

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Patent Owner(s)

Patent OwnerAddress
HITACHI LTDCHIYODA-KU TOKYO 100-8280

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Endou, Hisashi Tokyo, JP 7 11
Kakeno, Nobuhiro Tokyo, JP 9 6
Kitaoka, Masanori Tokyo, JP 4 2
Yamada, Toshihiro Tokyo, JP 73 706
Yoshikawa, Hiroshi Tokyo, JP 160 1646

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