Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making

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United States of America Patent

PATENT NO 11982689
APP PUB NO 20240094253A1
SERIAL NO

17572892

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Abstract

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Embodiments are directed to microscale and millimeter scale multi-layer structures (e.g., probe structures for making contact between two electronic components for example in semiconductor wafer, chip, and electronic component test applications). One or more layers of the structures include shell and core regions formed of different materials wherein the core regions are offset from a symmetric, longitudinally extending position.

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Patent Owner(s)

Patent OwnerAddress
MICROFABRICA INC7911 HASKELL AVENUE VAN NUYS CA 91406

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Smalley, Garret R Newhall, US 5 7

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