Cooling system for downhole electronic device
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United States of America Patent
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May 14, 2024
Grant Date -
Nov 10, 2022
app pub date -
Jun 30, 2020
filing date -
Jul 4, 2019
priority date (Note) -
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Abstract
The present invention is related to cooling systems for electronic devices used in downhole operations. In this scenario, the present invention provides a downhole electronic device cooling system comprising a first heat exchanger element (1) internal to a heat exchanger vessel (3), and a second heat exchanger element (2) associated with the electronic device (4), wherein the first (1) and second (2) heat exchanger elements are in fluid communication by a cooling fluid, wherein the heat exchanger vessel (3) allows the circulation of a secondary cooling fluid.
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