High-temperature fast-curing starch-based adhesive for particleboards and preparation method thereof

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United States of America Patent

PATENT NO 11981834
APP PUB NO 20240101873A1
SERIAL NO

18530577

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Abstract

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The present disclosure discloses a high-temperature fast-curing starch-based adhesive for particleboards and a preparation method thereof, belonging to the technical field of adhesive preparation. The low viscosity of the starch-based adhesive is ensured by selecting a crosslinking monomer which does not self-crosslink in a reaction process in the present disclosure, and a binary crosslinking agent matched with the crosslinking monomer is added before use to be quickly crosslinked with the crosslinking monomer at high temperature so as to ensure better thermosetting property and water resistance as well as faster curing speed of the starch-based adhesive at the same time, which meets the requirements of the particleboards for the adhesive, solves the problem of long curing time of the existing starch-based adhesives at high temperatures, further shortens the curing time of the starch-based adhesives to about 60 s, and improves the production efficiency of the particleboards.

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Patent Owner(s)

Patent OwnerAddress
JIANGNAN UNIVERSITYNO 1800 ROAD 214122 JIANGSU LIHU BINHU DISTRICT CITY OF WUXI PROVINCE WUXI CITY JIANGSU PROVINCE 214122

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ban, Xiaofeng Wuxi, CN 6 0
Cheng, Li Wuxi, CN 78 442
Gu, Zhengbiao Wuxi, CN 15 1
Hong, Yan Wuxi, CN 45 138
Jin, Junnan Wuxi, CN 2 0
Li, Caiming Wuxi, CN 15 1
Li, Zhaofeng Wuxi, CN 27 3
Wu, Dongdong Wuxi, CN 30 52
Yin, Jian Wuxi, CN 109 2509
Zhang, Mengwei Wuxi, CN 3 0

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