Integrated abrasive polishing pads and manufacturing methods

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United States of America Patent

PATENT NO 11980992
APP PUB NO 20230052048A1
SERIAL NO

17946547

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized abrasive particles in an additive manufacturing process, such as a 3D inkjet printing process. In one embodiment, a method of forming a polishing article includes dispensing a first plurality of droplets of a first precursor, curing the first plurality of droplets to form a first layer comprising a portion of a sub-polishing element, dispensing a second plurality of droplets of the first precursor and a second precursor onto the first layer, and curing the second plurality of droplets to form a second layer comprising portions of the sub-polishing element and portions of a plurality of polishing elements. Here, the second precursor includes functionalized abrasive particles having a polymerizable group chemically bonded to surfaces thereof.

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Patent Owner(s)

Patent OwnerAddress
APPLIED MATERIALS INC3050 BOWERS AVENUE SANTA CLARA CA 95054

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Arnepalli, Ranga Rao Andhra Pradesh, IN 23 1040
Bajaj, Rajeev San Jose, US 162 3380
Chockalingam, Ashwin Santa Clara, US 31 596
Cornejo, Mario Dagio San Jose, US 4 33
Fu, Boyi San Jose, US 39 664
Ganapathiappan, Sivapackia Los Altos, US 234 1902
Kumar, Ashavani Sunnyvale, US 46 1002
Patibandla, Nag B Pleasanton, US 159 2040
Redeker, Fred C Fremont, US 195 5499
Redfield, Daniel Morgan Hill, US 65 1172
Sinha, Amritanshu Sunnyvale, US 5 173
Zhao, Yan Santa Clara, US 300 2671

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