Solder joint part and method for manufacturing the same

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United States of America

PATENT NO 11980974
SERIAL NO

17294379

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Abstract

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In a method for manufacturing a solder joint part, at least one of a first metal base material and a second metal base material is an alloy containing Ni in an amount of more than 0 wt % and less than 44 wt % and Cu in an amount of more than 56 wt %, and solder is a solder alloy containing Ga and inevitable impurities or a solder alloy containing Ga as a main component and having a melting point of 30° C. or lower. The method includes applying the solder to a surface of the first metal base material and placing the second metal base material on the applied solder, and heating the first and second metal base materials to a temperature of 90° C. or lower in a specified atmosphere or in a liquid to generate CuGa2 or (Cu, Ni)Ga2 between the first and second metal base materials, thereby joining the first and second metal material.

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Patent Owner(s)

Patent OwnerAddress
NIHON SUPERIOR CO LTD1-16-15 ESAKACHO SUITA-SHI OSAKA 5640063

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Akaiwa, Tetsuya Osaka, JP 4 5
Liu, Shiqian Brisbane, AU 1 0
Mcdonald, Stuart David Brisbane, AU 4 4
Nishimura, Takatoshi Tokyo, JP 32 128
Nishimura, Tetsuro Suita, JP 38 188
Nogita, Kazuhiro Brisbane, AU 5 10

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