Electronic device image sensor
Number of patents in Portfolio can not be more than 2000
United States of America
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May 7, 2024
Grant Date -
N/A
app pub date -
Dec 21, 2020
filing date -
Dec 21, 2020
priority date (Note) -
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Abstract
An electronic device includes a substrate semiconductor wafer with semiconductor portions separated from one another by through-passages. Electronic circuits and a dielectric layer with a network of electrical connections are formed at a front face of the substrate semiconductor wafer. Electrically conductive fillings are contained within the through-passages and are connected to the network of electrical connections. Interior dielectric layers for anti-diffusion protection are provided in the through-passages between the electrically conductive fillings and the semiconductor portions. Back side dielectric layers are joined to the interior dielectric layers.
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