Temperature sensing circuit including multiple thermistors
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United States of America Patent
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May 7, 2024
Grant Date -
May 25, 2023
app pub date -
May 28, 2020
filing date -
May 30, 2019
priority date (Note) -
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Abstract
Temperature sensing circuits for devices described herein include a substrate material, a first conductive portion, a second conductive portion, and a third conductive portion associated with the substrate material, and a plurality of thermistors associated with the substrate material for sensing a temperature associated with the device. The plurality of thermistors include a first thermistor and a second thermistor. The first thermistor is connected to the first conductive portion. The first thermistor and the second thermistor are both connected to the second conductive portion. The second thermistor is connected to the third conductive portion.
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