Cooling system for moulds
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United States of America Patent
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May 7, 2024
Grant Date -
Jul 23, 2020
app pub date -
Feb 16, 2018
filing date -
Feb 16, 2017
priority date (Note) -
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Abstract
Evaporative cooling system (1) having a closed fluid circuit operating at below atmospheric pressure to remove heat from a mould assembly (3). The system (1) includes a cooling fluid supply source (5) connected to a mould assembly (3) to supply cooling fluid in liquid phase to hollow cooling chambers (13) of the mould assembly (3). Heat is removed by evaporation of the cooling fluid upon contact with the internal wall surfaces (29) of the cooling chamber (13). The rate of heat removal is regulated by controlling flow of fluid and/or pressure within the system in response to a) temperature measurements in the mould assembly (3), and/or b) pressure measurements with the fluid circuit, such that the cooling chamber (13) remains substantially free of cooling fluid in the liquid phase with cooling fluid entering the chamber (13) evaporating upon contact with the internal wall surfaces of the chamber (13).
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