Method and system for process and temperature compensation in a transimpedance amplifier using a dual replica
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United States of America Patent
Stats
-
Apr 30, 2024
Grant Date -
May 25, 2023
app pub date -
Jan 24, 2023
filing date -
Jan 16, 2015
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The present disclosure provides for process and temperature compensation in a transimpedance amplifier (TIA) using a dual replica via monitoring an output of a first TIA (transimpedance amplifier) and a second TIA; configuring a first gain level of the first TIA based on a feedback resistance and a reference current applied at an input to the first TIA; configuring a second gain level of the second TIA and a third TIA based on a control voltage; and amplifying a received electrical current to generate an output voltage using the third TIA according to the second gain level. In some embodiments, one or both of the second TIA and the third TIA include a configurable feedback impedance used in compensating for changes in the second gain level due to a temperature of the respective second or third TIA via the configurable feedback impedance of the respective second or third TIA.
First Claim
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International Classification(s)
- 2023 Application Filing Year
- H01L Class
- 19835 Applications Filed
- 4214 Patents Issued To-Date
- 21.25 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- H01L Class
- 0 % this patent is cited more than
- 1 Age
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