Laser bonding system and laser bonding apparatus
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
-
Apr 30, 2024
Grant Date -
N/A
app pub date -
Apr 12, 2021
filing date -
Apr 12, 2021
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A laser bonding system which improves bonding between a semiconductor chip and a substrate is provided. A laser bonding system comprises a laser bonding apparatus; and a controller configured to control the laser bonding apparatus, wherein the laser bonding apparatus includes a stage which supports a substrate including a pad, and a semiconductor chip including a connection terminal; a pressurizer which moves up and down above the stage; a temperature measuring sensor configured to measure a temperature of the semiconductor chip and generate a temperature value; and a laser radiation apparatus configured to bond a pad of the substrate and a connection terminal of the semiconductor chip, using a laser beam passing through the pressurizer, and the controller lifts the pressurizer in response to the temperature value.
First Claim
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Family
International Classification(s)
- 2021 Application Filing Year
- H01L Class
- 28775 Applications Filed
- 15216 Patents Issued To-Date
- 52.88 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- H01L Class
- 0 % this patent is cited more than
- 1 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
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