Semiconductor package and method for manufacturing the same
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
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Apr 30, 2024
Grant Date -
N/A
app pub date -
Nov 8, 2021
filing date -
Nov 8, 2021
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A semiconductor package includes a first die having a first surface, a first conductive bump over the first surface and having first height and a first width, a second conductive bump over the first surface and having a second height and a second width. The first width is greater than the second width and the first height is substantially identical to the second height. A method for manufacturing the semiconductor package is also provided.
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International Classification(s)
- 2021 Application Filing Year
- H01L Class
- 28775 Applications Filed
- 15216 Patents Issued To-Date
- 52.88 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- H01L Class
- 0 % this patent is cited more than
- 1 Age
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