Ceramic metal circuit board and semiconductor device using the same

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United States of America Patent

PATENT NO 11973003
APP PUB NO 20230154826A1
SERIAL NO

18156499

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Abstract

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According to one embodiment, a ceramic metal circuit board is a ceramic metal circuit board formed by bonding metal circuit plates to at least one surface of a ceramic substrate. At least one of the metal circuit plates has an area of not less than 100 mm2 and includes a concave portion having a depth of not less than 0.02 mm within a range of 1% to 70% of a surface of the at least one of the metal circuit plates. The concave portion is provided not less than 3 mm inside from an end of the metal circuit plate.

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Patent Owner(s)

Patent OwnerAddress
KABUSHIKI KAISHA TOSHIBA1-1 SHIBAURA 1-CHOME MINATO-KU TOKYO 105-0023

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kato, Hiromasa Nagareyama Chiba, JP 57 225
Naba, Takayuki Chigasaki Kanagawa, JP 28 372
Yano, Keiichi Yokohama Kanagawa, JP 53 788

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