Gas flow accelerator to prevent buildup of processing byproduct in a main pumping line of a semiconductor processing tool
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United States of America
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Apr 30, 2024
Grant Date -
N/A
app pub date -
Jul 31, 2020
filing date -
Jul 31, 2020
priority date (Note) -
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Abstract
A gas flow accelerator may include a body portion, and a tapered body portion including a first end integrally formed with the body portion. The gas flow accelerator may include an inlet port connected to the body portion and to receive a process gas to be removed from a semiconductor processing tool by a main pumping line. The semiconductor processing tool may include a chuck and a chuck vacuum line to apply a vacuum to the chuck to retain a semiconductor device. The tapered body portion may be configured to generate a rotational flow of the process gas to prevent buildup of processing byproduct on interior walls of the main pumping line. The gas flow accelerator may include an outlet port integrally formed with a second end of the tapered body portion. An end portion of the chuck vacuum line may be provided through the outlet port.
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