Resin composition, prepreg for printed circuit and metal-coated laminate

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United States of America

PATENT NO 11970591
SERIAL NO

17287911

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Abstract

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Provided is a resin composition, a prepreg for a printed circuit and a metal-coated laminate. The resin composition includes: a silicone aryne resin, a polyphenylene ether resin with unsaturated bonds, and a butadiene polymer. The resin composition is used such that the prepared metal-coated laminate can have at least one of the following characteristics: a low dielectric loss factor, high heat resistance, and a low coefficient of thermal expansion.

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Patent Owner(s)

Patent OwnerAddress
SHENGYI TECHNOLOGY CO LTDNO 5 GONGYE WEST ROAD SONGSHAN LAKE PARK DONGGUAN CITY GUANGDONG PROVINCE 523808 DONGGUAN CITY GUANGDONG PROVINCE 523808

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fang, Kehong Guangdong, CN 13 17
Meng, Yundong Guangdong, CN 5 3

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