Polyamic acid resin and polyamideimide film

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United States of America Patent

PATENT NO 11970579
APP PUB NO 20210040267A1
SERIAL NO

17077676

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Abstract

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Provided are a polyamic acid resin derived from an aromatic diamine, an aromatic dianhydride, a cycloaliphatic dianhydride and an aromatic diacid dichloride, and a polyamideimide film including polyamideimide derived from an aromatic diamine, an aromatic dianhydride, a cycloaliphatic dianhydride and an aromatic diacid dichloride.

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Patent Owner(s)

  • SK INNOVATION CO., LTD.; SK GEO CENTRIC CO., LTD.; SK IE TECHNOLOGY CO., LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jang, Tae Sug Daejeon, KR 14 44
Kim, Hyeon Jeong Daejeon, KR 16 100
Park, Jin Hyung Daejeon, KR 39 99
Park, Sang Yoon Daejeon, KR 59 138

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