Package structure and method for manufacturing the same

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United States of America

PATENT NO 11970388
SERIAL NO

17550607

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Abstract

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A package structure and its manufacturing method are provided. The package structure includes a substrate with a recess, and a first MEMS chip, a first intermediate chip, a second MEMS chip and a first capping plate sequentially formed on the substrate. The lower surface of the first MEMS chip has a first sensor or a microactuator. The upper surface of the second MEMS chip has a second sensor or a microactuator. The first intermediate chip has a through-substrate via, and includes a signal conversion unit, a logic operation unit, a control unit, or a combination thereof. The package structure includes at least one of the first sensor and the second sensor.

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Patent Owner(s)

Patent OwnerAddress
WINBOND ELECTRONICS CORPNO 8 KEYA 1ST RD DAYA DISTRICT CENTRAL TAIWAN SCIENCE PARK TAICHUNG CITY

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Wu, Jin-Neng Tainan, TW 15 46

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