Method and device for milling large-diameter aspheric surface by using splicing method and polishing method
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United States of America
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Apr 30, 2024
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N/A
app pub date -
Jul 30, 2020
filing date -
Jul 30, 2020
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A method and device for milling a large-diameter aspheric surface by using a splicing method and a polishing method to solve the problems of large time consumption and serious tool wear in the machining of a meter-scale large-diameter aspheric surface are disclosed. where an aspheric surface is discretized into a series of rings with different radii, and the rings are sequentially machined via generating cutting by using an annular grinding wheel tool with an outer diameter less than ¼ of a diameter of the aspheric surface; the rings are equally spaced, there are a total of N rings, and a width of any ring is jointly determined by the Nth ring, the (N−1)th ring, positioning accuracy and a generatrix equation of the aspheric surface; and the aspheric surface is enveloped by a large number of rings. A contact area between the tool and a workpiece surface is rings.
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International Classification(s)
- 2020 Application Filing Year
- B24B Class
- 659 Applications Filed
- 346 Patents Issued To-Date
- 52.51 % Issued To-Date
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- 0 Citation Count
- B24B Class
- 0 % this patent is cited more than
- 1 Age
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