Systems for thermally treating conductive elements on semiconductor and wafer structures

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United States of America Patent

PATENT NO 11967576
APP PUB NO 20210335741A1
SERIAL NO

17370427

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Abstract

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Methods of reflowing electrically conductive elements on a wafer may involve directing a laser beam toward a region of a surface of a wafer supported on a film of a film frame to reflow at least one electrically conductive element on the surface of the wafer. In some embodiments, the wafer may be detached from a carrier substrate and be secured to the film frame before laser reflow. Apparatus for performing the methods, and methods of repairing previously reflowed conductive elements on a wafer are also disclosed.

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Patent Owner(s)

Patent OwnerAddress
MICRON TECHNOLOGY INCIDAHO IDAHO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Derderian, James M Boise, US 66 1132

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