Methods of manufacturing semiconductor chip
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United States of America Patent
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Apr 23, 2024
Grant Date -
Feb 25, 2021
app pub date -
Nov 10, 2020
filing date -
Aug 20, 2018
priority date (Note) -
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status (Latency Note)
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Abstract
Methods of manufacturing a semiconductor chip are provided. The methods may include providing a semiconductor substrate including integrated circuit regions and a cut region. The cut region may be between the integrated circuit regions. The methods may also include forming a modified layer by emitting a laser beam into the semiconductor substrate along the cut region, polishing an inactive surface of the semiconductor substrate to propagate a crack from the modified layer, and separating the integrated circuit regions along the crack. The cut region may include a plurality of multilayer metal patterns on an active surface of the semiconductor substrate, which is opposite to the inactive surface of the semiconductor substrate. The plurality of multilayer metal patterns may form a pyramid structure when viewed in cross section.
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