Thermal module for a circuit board
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United States of America Patent
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Apr 16, 2024
Grant Date -
Dec 21, 2023
app pub date -
Jun 17, 2022
filing date -
Jun 17, 2022
priority date (Note) -
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Abstract
An assembly for heat-generating components includes a metal and a non-metal layer. To secure to a circuit board that carries a heat-generating component, a metal standoff is secured on a perimeter of the circuit board. Multiple protruding elements of the metal layer of the assembly secure within a respective opening of the standoff. The assembly secures, through metal-to-metal contact, to the standoff by multiple mechanical couplings. The assembly not only covers the circuit board, but also extends laterally beyond the circuit board (and the circuit board components). As a result, the assembly receives thermal energy from a heat-generating component(s) on the circuit board and allows the thermal energy to flow through assembly from one portion of the assembly covering the heat-generating component(s) to the lateral portion of the assembly that does not cover the heat-generating component(s).
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