Resistance soldering device and method of using said device
Number of patents in Portfolio can not be more than 2000
United States of America
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Apr 16, 2024
Grant Date -
N/A
app pub date -
Jan 27, 2021
filing date -
Jan 27, 2021
priority date (Note) -
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Abstract
A resistance soldering device configured for using with an electrical terminal having a first surface and a second surface opposite the first surface on which a layer of a solder composition is disposed includes an electrode having a first electrical conductor configured to be connected to a positive pole of an electrical power supply, a second electrical conductor configured to be connected to a negative pole of the electrical power supply and an electrically resistive bridge interconnecting the first and second electrical conductors. A method of using such a device is also presented herein.
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