Optical lithography system and method of using the same

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United States of America Patent

PATENT NO 11960211
APP PUB NO 20230011701A1
SERIAL NO

17371204

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Abstract

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In an embodiment, an apparatus includes an energy source, a support platform for holding a wafer, an optical path extending from the energy source to the support platform, and a photomask aligned such that a patterned major surface of the photomask is parallel to the force of gravity, where the optical path passes through the photomask, where the patterned major surface of the photomask is perpendicular to a topmost surface of the support platform.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kuo, Hung-Jui Hsinchu, TW 427 1983
Lee, Ming-Tan Kaohsiung, TW 34 41
Yu, Ting-Yang Hsinchu, TW 6 4

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